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MHS Failure management policy |
Failure analysis management
MHS has developed some knowledge and know-how to do some physical and electrical failure analyses.
There are mainly used for:
 Process / product characterization development phase
Industrialized Process improvement (defect density, yield)
Lot qualification (space market)
Customer complaint
Failure analysis capacity
Internally: Characterization Lab in Nantes
 I(V) and C(V) characterization on manual probe stations
Reliability tests on wafer level: HCI ERCS (QBD), BEM
TLP (Transmission Time Pulse) test
Automatic measurements on HP4062UX
Temperature stress or bake up to 250°C
Externally: Subcontractors in Europe and Asia.
Analyses of factory effluent water, atmospheric air discharge, rain water discharge, legionella and bacteria counts
SEM and TEM analysis
Physical and electrical failure analysis
EMMI
AFM, FIB, SIMS capabilities
ESD and latch-up testing
Metallic contamnation analysis (TWRF)
SRP (Spreading Resistance) analysis
Metal Electromigation tests
Surface analysis with EDX or Auger method
Total dose radiation, SEU/SEL tests
Reliability test (EFR/LFR)
UV radiation
RoHS analysis
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