Customer Product Reliability

Develop partnership with customer to improve reliability results obtained on tests done by the customer.

Process robustness

Systematic use of DOE and corner lots for any new customer product qualification.
Analysis for any modification of DOE needs during the qualification plan definition.

Wafer Level Reliability

Periodic monitoring on the main technologies (electrical and physical characterization).
Use of Standard Evaluation Circuit periodic lots on the main technologies based on the FSA rules.

All results obtained each year are reported in the Technology Qualification Package (TQP) during the annual review. Customer product reliability results are reported anonymously and with customer agreement only. (Nantes).
FIT data is available for all major processes up until 2009 for Swindon.  Every new process has a full qualification package that can be obtained on request from the Quality department in Swindon.