Based on a foreseen volume wafer production, MHS Electronics offers customers the possibility to customize existing processes to adapt to their specific needs. The result of this customization will be an added-value for your product (Higher specific performance, tighter specification, additional embedded function.
This customization may consist in:
 Adding a new device
Adjust some device parameters
Adding a new process module
Our team expertise:
Complete process, or custom module, integration
Process optimization by numerical simulation
Process and device characterization
Design Rules documentation
Design Kit option update
Track of records, examples:
2Ghz compatible front-end device set addition in a Mixed-analog CMOS (Schottky diode, Varactor…)
Fuse metal device addition for specific analog trimming
Thick last metal layer for higher current drive capability
Backside pressure sensor integration with CMOS
Thin film passive device integration
MEMS integration within CMOS Metal interconnection layers
Fully Isolated Low Voltage NMOS transistor
We would be happy to discuss your requirements for customization or to transfer established processes.
To ask for a quotation or more details, please contact us at foundry@mhs-electronics.com or your regional sales.
Click here to also get to know our Fab to Fab Process Transfer Services.
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